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YES CTO Dr. Zia Karim to Address IEEE EPS Silicon Valley Chapter

Apr 30, 2021 2:41:02 PM / by YES Marketing posted in advanced packaging, IEEE

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The May meeting of the Silicon Valley Chapter of the IEEE Electronic Packaging Society (EPS) will feature a webcast by Dr. Zia Karim, Chief Technical Officer at YES, entitled “Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications.” Please visit the IEEE for details.

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YES Sponsoring the Virtual IMAPS Device Packaging Conference

Apr 9, 2021 8:51:31 PM / by YES Global Sales and Support posted in industry events, advanced packaging, imaps

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Visit YES at the virtual IMAPS Device Packaging Conference from April 12-15! You may register now for a complimentary Partner Profile Only Badge, which is comparable to a free Exhibit Hall pass at an in-person show and enables you to chat with us and other Partners. (Note that the complimentary badge does not provide access to any presentations/technical content, or the ability to chat with Speakers.) IMAPS membership is not required to sign up for the free pass.

Join this major forum attended by scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales and marketing professionals. Attend talks and networking opportunities in tracks covering 3D integration, FOWLP and flip chip, and automated advanced packaging for 5G devices.

We look forward to seeing you at the virtual conference next week!

CONTACT US to schedule an appointment at our booth or ask any questions.
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