The May meeting of the Silicon Valley Chapter of the IEEE Electronic Packaging Society (EPS) will feature a webcast by Dr. Zia Karim, Chief Technical Officer at YES, entitled “Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications.” Please visit the IEEE for details.
Join this major forum attended by scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales and marketing professionals. Attend talks and networking opportunities in tracks covering 3D integration, FOWLP and flip chip, and automated advanced packaging for 5G devices.
We look forward to seeing you at the virtual conference next week!
CONTACT US to schedule an appointment at our booth or ask any questions.